Silicon Machining

April 13-16, 1998
LaPlaya Hotel
Carmel-by-the-Sea, California

PDF versions of the abstracts of the 1998 Spring Topical Meeting Proceedings are not available. Contact ASPE to purchase a copy of the Proceedings. ASPE does not sell individual copies of abstracts.


Session I-A
Silicon as a Material
Tuesday, April 14, 8:30 a.m. - 10:00 a.m.
Session Chair: Daniel C. Thompson, LLNL

  1. Silicon (Invited Paper)
    W. A. Goodman (Schafer Corporation)
    Silicon Machining - Silicon as a Material/Oral/Abstract/1998 Spring
  2. Silicon as an IR Optical Material (Invited Paper)
    D. J. Neil (Raytheon Systems)
    Silicon Machining - Silicon as a Material/Oral/No Abstract Available/1998 Spring

Session I-B
Silicon as a Material
Tuesday, April 14, 10:30 a.m. - 12:00 p.m.
Session Chair: Daniel C. Thompson, LLNL

  1. Silicon as a Mirror Material (Invited Paper)
    L. H. Skolnik (Department of Defense)
    Silicon Machining - Silicon as a Material/Oral/No Abstract Available/1998 Spring
  2. Silicon Integrated Circuit Technology: Engine for the Electronics Industry (Invited Paper)
    S. Knight (NIST)
    Silicon Machining - Silicon as a Material/Oral/Abstract/1998 Spring
  3. Silicon as a MEMS Material (Invited Paper)
    D. R. Ciarlo (LLNL)
    Silicon Machining - Silicon as a Material/Oral/No Abstract Available/1998 Spring

Session II
Material Properties
Tuesday, April 14, 1:00 p.m. - 2:30 p.m.
Session Chair: Michael Kerstan (Wacker Siltronic AG)

  1. Deformation of Silicon by Shear Flow or Phase Transition
    J. C. Lambropoulos, S. J. Burns, K-H. Chen, S. D. Jacobs (University of Rochester)
    Silicon Machining - Material Properties/Oral/Abstract/1998 Spring
  2. The Anomalous Behavior of Silicon During Nanoindentation
    G. M. Pharr (Rice University)
    Silicon Machining - Material Properties/Oral/No Abstract Available/1998 Spring
  3. Surface Amorphization of Machined Silicon (Invited Paper)
    K . E. Puttick, C. Jeynes (University of Surrey) and A. E. Gee (Cranfield University)
    Silicon Machining - Material Properties/Oral/Abstract/1998 Spring

Session III
Tool/Workpiece Interaction
Tuesday, April 14, 3:00 p.m. - 4:30 p.m.
Session Chair: John A. Patten (UNC-Charlotte)

  1. Thermal Modeling of Silicon Machining: Issues and Challenges
    H. A. Abdel-Aal, S. T. Smith (UNC-Charlotte)
    Silicon Machining - Tool - Workpiece Interaction/Oral/Abstract/1998 Spring
  2. Process Characterization for CO2 Laser Cutting of Silicon Using Four-point Bend Testing and LEFM
    F. M. Mess, C. Narayanan (Lucent Technologies, Inc.) and S. Danyluck (Georgia Institute of Technology)
    Silicon Machining - Tool - Workpiece Interaction/Oral/No Abstract Available/1998 Spring
  3. Anisotropy of Scratching and Indentation Fracture of Single Crystal Silicon
    K. E. Puttick (University of Surrey)
    Silicon Machining - Tool - Workpiece Interaction/Oral/No Abstract Available/1998 Spring

Session IV
Polishing
Wednesday, April 15, 8:30 a.m. - 10:00 a.m.
Session Chair: Robert E. Parks (Optical Perspectives Group)

  1. High-performance Dry Mechanochemical Polishing of Si Wafer Using Soft BaCo3 Abrasive
    N. Yasunaga, M. Takashina, T. Inoue (Tokai University) and S. Tanaka, Y. Yamamoto (Sumitomo-Osaka Cement Co., Ltd.)
    Silicon Machining - Polishing/Oral/Abstract/1998 Spring
  2. On the Lapping and Polishing of Silicon
    C. J. Evans, M. L. McGlauflin (NIST), R. E. Parks (Optical Perspectives Group) and D. J. Roderick (Rodel, Inc.)
    Silicon Machining - Polishing/Oral/No Abstract Available/1998 Spring
  3. The Effect of Fluids on the Ductile Response of Silicon During Abrading
    J. A. Patten (UNC-Charlotte)
    Silicon Machining - Polishing/Oral/Abstract/1998 Spring

Session V
Turning and Grinding
Wednesday, April 15, 10:30 a.m. - 12:30 p.m.
Session Chair: Hiroshi Hashimoto (Kanagawa Institute of Technology)

  1. Ultraprecision Grinding and Single Point Diamond Turning of Silicon Wafers and their Characterization
    M. Kerstan, A. Ehlert, A. Huber, D. Helmreich (Wacker Siltronic AG) and J. Beinert, W. Doll, M. G. Schinker (Fraunhofer Institut fur Werkstoffmechanik)
    Silicon Machining - Turning and Grinding/Oral/Abstract/1998 Spring
  2. Epistemology and Abduction in Shear(ductile)-mode Grinding of Brittle Materials (Invited Paper)
    Silicon Machining - Turning and Grinding/Oral/Abstract/1998 Spring
  3. Traverse Grinding Characteristics of Resin Bond Diamond Wheel with New Profile in Precision Grinding of Silicon Wafers
    M. Daito (Nissin Machine Works), A. Kanai (Ashikaga Institute of Technology), and M. Miyashita (Nano-Tec Associates)
    Silicon Machining - Turning and Grinding/Oral/Abstract/1998 Spring
  4. An Empirical Survey on the Influence of Machining Parameters in Diamond Turning of Large Single Crystal Silicon Optics
    C. K. Syn, D. A. Drulewich, P.J. Davis, P. C. DuPuy, M. A. Wall, K. L. Blaedel (LLNL) and M. R. McClellan (Schafer Corp.)
    Silicon Machining - Turning and Grinding/Oral/Abstract/1998 Spring

Session VI
Applications and Metrology
Thursday, April 16, 8:30 a.m. - 10:00 a.m.
Session Chair: Chris J. Evans (NIST)

  1. High Resolution X-ray Measurements for Surface and Sub-surface Silicon Characterization
    M. S. Goorsky (University of California at Los Angeles)
    Silicon Machining - Applications and Metrology/Oral/No Abstract Available/1998 Spring
  2. Fabrication of 1KG Single Crystal Silicon Super-Precison Spheres (Balls) for the Avogadro's Experiment
    A. J. Leistner (CSIRO Telecommunications and Industrial Physics)
    Silicon Machining - Applications and Metrology/Oral/Abstract/1998 Spring
  3. Acoustic Emission Sensing as a Tool for Manufacturing Process Control (Invited Paper)
    D. A. Dornfield (University of California at Berkeley)
    Silicon Machining - Applications and Metrology/Oral/Abstract/1998 Spring

Session VII
Machine Design
Thursday, April 16, 10:30 a.m. - 12:00 p.m.
Session Chair: Kenneth L. Blaedel (LLNL)

  1. Design Concept of Multi-wire Saw for 400mm Diameter Silicon Ingot Slicing
    H. Oishi, K. Asakawa, J. Matsuzaki (Super Silicon Crystal Research Institute Corporation)
    Silicon Machining - Machine Design/Oral/Abstract/1998 Spring
  2. Development of an Ultraprecision Grinding Machine for Super-large and Super-flat Silicon Wafer - Proposal of Trigonal Prism Type Pentahedral Structure
    K. Abe, S. Okawa (Super Silicon Crystal Research Institute Corporation), and Y. Koma, K. Arai (DISCO Corporation)
    Silicon Machining - Machine Design/Oral/Abstract/1998 Spring
  3. Ductile Mode Cutting of Silicon Microparts
    T. Hellmold, J. Zeadan, L. P. Ruhbach, H. H. Gatzen (Hanover University)
    Silicon Machining - Machine Design/Oral/Abstract/1998 Spring

Session VIII
Wrap-Up
Thursday, April 16, 1:00 p.m. - 2:30 p.m.
Session Chair: John A. Patten (UNC-Charlotte) and Daniel C. Thompson (LLNL)

  1. Technical Details of Silicon Machining Behavior from a Diamond Toolmaker's Perspective
    G. A. Kim (Edge Technologies)
    Silicon Machining/Oral/Abstract/1998 Spring
  2. Proposal to the Science Foundation (NSF) to Research Silicon Machining
    J. A. Patten (UNC-Charlotte)
    Silicon Machining/Oral/Abstract/1998 Spring

Poster Session
Wednesday, April 15, 7:00 p.m. - 9:30 p.m.

  1. Cost Effective Edge Machining of Silicon Wafers to Minimize the Polishing Process
    M. J. Ball, K. Carlisle, M. A. Stocker (Cranfield Precision)
    Silicon Machining/Poster/Abstract/1998 Spring
  2. Ductile to Brittle Transition Investigated by Plunge-cut Experiments in Monocrystalline Silicon
    E. Brinksmeier, W. R. Preuss, O. Riemer, R. Malz (Universitat Bremen)
    Silicon Machining/Poster/Abstract/1998 Spring
  3. Cutting Fluid Study for Single Crystal Silicon
    D. Chargin (LLNL)
    Silicon Machining/Poster/Abstract/1998 Spring
  4. Monitoring Brittle/Ductile Material Removal Mechanisms in Micro-machining Using Wavelet Packet Analysis and Green's Function Solutions of AE Signals
    X. Chen, D. A. Dornfield (University of California at Berkeley)
    Silicon Machining/Poster/Abstract/1998 Spring
  5. Material Removal Rate vs. Power in Silicon Wafer Dicing
    H. Eshel, I. Weisshaus (Kulicke & Soffa Industries)
    Silicon Machining/Poster/Abstract/1998 Spring
  6. Superpolishing by a Tin Polisher
    H. Gao, B. Chen, J. Cao (State Key Laboratory of Applied Optics)
    Silicon Machining/Poster/Abstract/1998 Spring
  7. Silicon Spheres for Gravity Probe B Experiment
    F. Marcelja, G. M. Keiser (Stanford University)
    Silicon Machining/Poster/Abstract/1998 Spring
  8. TEM Results from a Multi-parameters Single-point Diamond Turning Study on Single Crystal Silicon
    M. T. McClellan, S. C. Faulk, K. R. Shillito (Schafer Corporation)
    Silicon Machining/Poster/Abstract/1998 Spring
  9. Investigation of the Relationship Between Preston's Coefficient and Friction Coeffiecient in Chemical Mechanical Polishing (CMP) of Silicon
    Y. Moon, D. A. Dornfield (University of California at Berkeley)
    Silicon Machining/Poster/Abstract/1998 Spring
  10. Mechanical Properties and Relationship to Process Performance of the Polishing Pad in Chemical Mechanical Polishing (CMP) of Silicon
    Y. Moon, I. Park, D. A. Dornfield (University of California at Berkeley)
    Silicon Machining/Poster/Abstract/1998 Spring
  11. Cutting Tool Edge Radius and Depth of Cut Influence on the Generation of the High Pressure Phase Transformation During Ductile Machining
    J. A. Patten (UNC-Charlotte)
    Silicon Machining/Poster/Abstract/1998 Spring
  12. Evaluation of Effective CMP Conditions by Estimation of Pressure Distribution on Semiconductor Wafer
    Y. Sasaki, H. Aoyama, I. Inasaki (Keio University) and H. Miyairi, H. Shibaya (Mitsubishi Materials Corporation)
    Silicon Machining/Poster/Abstract/1998 Spring
  13. Pressure Distribution at the Silicon/Polishing Pad Interface
    L. Shan, J. Levert, S. Danyluk (Georgia Institute of Technology)
    Silicon Machining/Poster/Abstract/1998 Spring