TouchDown Technologies

Lithography Engineer

The lithography engineer will be a member of the process integration department. The candidate will support the process development of thick film photolithography and its transfer into manufacturing.

Requirements:

BS with 3+ years experience, MS or recent graduate Ph.D. in MEMS, material science or related engineering discipline.
Experience in photolithography.

Desired:

Experience in MEMS processing in a clean room environment.
Thick film (20+ micrometer) lithography experience: Resist application and exposure.
Strong skills in metrology (Optical CMM, Profilometer, SEM).
Strong data analysis skills and experience with SPC.
Proficiency in MatLab.

Responsibilities:

Photoresist process development including surface preparation and curing.
Projection photolithography exposures and resist development for high aspect ratio MEMS structures.
Dimensional metrology of microstructures.
Extensive data analysis of experimental results.
Support the development, evaluation and transfer of new processes into manufacturing.
Support evaluation and acceptance of new equipment, chemistries, tooling, metrology and processes.

Touchdown Technologies (TdT), is a venture financed, pre-IPO startup focused on advanced MEMS-based probecards for semiconductor test. State of the art clean-room facilities and process equipment provide for cutting-edge MEMS technology innovation. Proprietary device designs and microfabrication processes enable highly parallel, large area, on-wafer probing of semiconductor products for our world-wide customer base.

Please send your application to info@tdtech.com and include “Lithography Engineer” in the subject line.