| Abstract
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2075 |
| Title |
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WITHDRAWN - Investigation of the Fracture Behaviour During the Dicing of Brittle Materials |
| Category |
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Processes: Machining |
| Primary
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| Organization |
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| Content |
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Owing to the fast development in semiconductor and opto-electronic industry, demands for precision devices/components made of brittle materials such as single crystal silicon, various glasses, and III-V group based compounds (GaAs, GaP…) are increasing rapidly for their advanced physical and/or optical properties. However, it is always a difficult task to grind, polish, turn and dice these hard and brittle materials to the specified roughness and/or dimension accuracy. Dicing operation is normally carried out when all the circuits are in place on the wafer and is used to separate individual dies for packaging. Any mistake made during the dicing process will always be a very costly one. This study aimed to investigate the fracture behavior during dicing silicon wafer by a diamond tool. Effect of dicing parameters such as rake angle, vertical load and dicing speed on the resulted crack propagation and chipping were studied. Finite element method was also adopted in this research to simulate the tool/wafer interaction during the dicing/scratching operation and the results were used to correlate to the experimental results. It was found that both median and lateral cracks introduced by the dicing operation increased with the tool tilt angle and vertical load. The lateral cracks would increase with the dicing speed while median cracks decreased. |
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