| Abstract
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2034 |
| Title |
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Analysis of Temperature Distribution and Optimization of the Configuration at Heating Tool in the Chip Bonding Process at Camera Module of Mobile Phone |
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Equipment, Machines & Instruments: Analysis & Modeling |
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| Content |
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The camera module of mobile phone has core components manufactured by adopting Complementary Metal-Oxide Semiconductor (CMOS) chip module. Recently, the Chip on FPCB (COF) method using Anisotropic Conductive Film (ACF) is increasing in the fabrication of CMOS chip module. While the bonding process using ACF is performed, two important points should be considered; precise alignment between substrate and Integrated Chip (IC) and uniform conductivity in electrode intervals that stand face to face with conductive particle at final bonding process.
In the process, the bad influences are exerted by following: the non-uniform temperature distribution at the bonding surface in the heating tool, long time use of the heating tool, very small bubbles during bonding process, and so on. In order to solve these problems, the accurate recognition of the temperature distribution at bonding surface is very important.
In this paper, the procedure for minimizing the temperature variation of bonding surface by the experiment and analysis methods is discussed. Generally experiments are carried out to find the main factors using design of experiment. However, doing experiments for all cases is expensive and time-consuming. Therefore a finite element model is built comparing with the experimental data. The main factors are chosen to reduce the variation of the temperature distribution at the bonding surface. An objective function of those factors is established to optimize the configuration of the heating tool using a mathematical model. Sequential Quadratic Programming (SQP) is used to solve the objective function. Finally, the procedure for finding the configuration of optimized heating tool is verified with experiments.
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